Solderless breadboard 400 Tie Points – Adhesive Back – Detachable Power Lanes

CAD 3.80

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Availability: In stock (can be backordered) SKU: 26058
Quantity 3 - 9 CAD 3.42
Quantity 10 - 24 CAD 3.33
Quantity 25 + CAD 3.23


Solderless breadboard with 400 tie points. The backside has an adhesive pad on it, to stick the breadboard on any surface. The 2 power lanes are detachable, and all parts (main panel and power lanes) are tongued and grooved. This way, you can build your own supersized breadboard (see example pictures).

Each board is 82 x 55 mm x 8.5 mm and can accept solid patch wires with a diameter of 0.3 to 0.8 mm diameter (AWG 20-29). The maximum current per lane must not exceed 5A, the insulation voltage between the lanes is 300V, and must not be exceeded as well.

Check out our Power Supply and USB-UART Module for solderless breadboards.

Breadboard 830


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